4 Papers
2 Citations
Arin Ryu is an academic researcher from University of Illinois at Urbana–Champaign. The author has contributed to research in topics: Vital signs & Intensive care. The author has an hindex of 3, co-authored 4 publications.
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Papers
Binodal, wireless epidermal electronic systems with in-sensor analytics for neonatal intensive care
Ha Uk Chung,Bong Hoon Kim,Jong Yoon Lee,Jungyup Lee,Zhaoqian Xie,E. Ibler,E. Ibler,Kun Hyuck Lee,Anthony Banks,Ji Yoon Jeong,Jongwon Kim,Jongwon Kim,Christopher Ogle,Dominic Grande,Yongjoon Yu,Hokyung Jang,Pourya Assem,Dennis Ryu,Jean Won Kwak,Myeong Namkoong,Jun Bin Park,Yechan Lee,Do Hoon Kim,Arin Ryu,Jaeseok Jeong,Kevin You,Bowen Ji,Zhuangjian Liu,Qingze Huo,Xue Feng,Yujun Deng,Yujun Deng,Yeshou Xu,Yeshou Xu,Kyung In Jang,Jeonghyun Kim,Yihui Zhang,Roozbeh Ghaffari,Casey M. Rand,Molly Schau,Aaron Hamvas,Debra E. Weese-Mayer,Yonggang Huang,Seungmin Lee,Chi Hwan Lee,Naresh R. Shanbhag,Amy S. Paller,Amy S. Paller,Shuai Xu,John A. Rogers +49 more
TL;DR: It is now possible to fabricate wireless, battery-free vital signs monitoring systems based on ultrathin, “skin-like” measurement modules that can gently and noninvasively interface onto the skin of neonates with gestational ages down to the edge of viability.
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Mechanically Guided Post-Assembly of 3D Electronic Systems
Bong Hoon Kim,Fei Liu,Yongjoon Yu,Hokyung Jang,Zhaoqian Xie,Zhaoqian Xie,Kan Li,Kan Li,Jungyup Lee,Ji Yoon Jeong,Arin Ryu,Yechan Lee,Do Hoon Kim,Xueju Wang,Kun Hyuck Lee,Jong Yoon Lee,Sang Min Won,Nuri Oh,Jeonghyun Kim,Ju Young Kim,Seong Jun Jeong,Kyung In Jang,Seungmin Lee,Yonggang Huang,Yihui Zhang,John A. Rogers +25 more
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Electronic Stuctures: Mechanically Guided Post-Assembly of 3D Electronic Systems (Adv. Funct. Mater. 48/2018)
Bong Hoon Kim,Fei Liu,Yongjoon Yu,Hokyung Jang,Zhaoqian Xie,Zhaoqian Xie,Kan Li,Kan Li,Jungyup Lee,Ji Yoon Jeong,Arin Ryu,Yechan Lee,Do Hoon Kim,Xueju Wang,Kun Hyuck Lee,Jong Yoon Lee,Sang Min Won,Nuri Oh,Jeonghyun Kim,Ju Young Kim,Seong-Jun Jeong,Kyung In Jang,Seungmin Lee,Yonggang Huang,Yihui Zhang,John A. Rogers +25 more
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Three-Dimensional Silicon Electronic Systems Fabricated by Compressive Buckling Process
Bong Hoon Kim,Jungyup Lee,Sang Min Won,Zhaoqian Xie,Jan-Kai Chang,Yongjoon Yu,Youn Kyoung Cho,Hokyung Jang,Ji Yoon Jeong,Yechan Lee,Arin Ryu,Do Hoon Kim,Kun Hyuck Lee,Jong Yoon Lee,Fei Liu,Xueju Wang,Qingze Huo,Seunghwan Min,Di Wu,Di Wu,Bowen Ji,Anthony Banks,Anthony Banks,Jeonghyun Kim,Nuri Oh,Hyeong Min Jin,Seungyong Han,Daeshik Kang,Chi Hwan Lee,Young Min Song,Yihui Zhang,Yonggang Huang,Kyung In Jang,John A. Rogers +33 more
TL;DR: Further capabilities for directly embedding high-performance electronic devices into the resultant 3D constructs based on silicon nanomembranes as the active materials in custom devices or microscale components released from commercial wafer sources are established.