In order to achieve lower fuel consumption and less greenhouse gas (GHG) emissions, we need higher efficiency vehicles with improved performance. Electrification is the most promising solution to enable a more sustainable and environmentally friendly transportation system. Electrified transportation vision includes utilizing more electrical energy to power traction and nontraction loads in the vehicle. In electrified powertrain applications, the efficiency of the electrical path, and the power and energy density of the components play important roles to improve the electric range of the vehicle to run the engine close to its peak efficiency point and to maintain lower energy consumption with less emissions. In general, the electrified powertrain architecture, design and control of the powertrain components, and software development are coupled to facilitate an efficient, high-performance, and reliable powertrain. In this paper, enabling technologies and solutions for the electrified transportation are discussed in terms of power electronics, electric machines, electrified powertrain architectures, energy storage systems (ESSs), and controls and software.

Making the Case for Electrified Transportation

In recent decades, several factors such as environmental protection, fossil fuel scarcity, climate change and pollution have driven the research and development of a more clean and sustainable transport. In this context, several agencies and associations, such as the European Union H2020, the United States Council for Automotive Research (USCAR) and the United Nations Economic and Social Commission for Asia (UN ESCAP) have defined a set of quantitative and qualitative goals in terms of efficiency, reliability, power losses, power density and economical costs to be met by next generation hybrid and full electric vehicle (HEV/EV) drive systems. As a consequence, the automotive electric drives (which consists of the electric machine, power converter and their cooling systems) of future vehicles have to overcome a number of technological challenges in order to comply with the aforementioned technical objectives. In this context, this paper presents, for each component of the electric drive, a comprehensive review of the state of the art, current technologies, future trends and enabling technologies that will make possible next generation HEV/EVs.

Next generation electric drives for HEV/EV propulsion systems: Technology, trends and challenges

Power electronics modules in electric vehicles and hybrid electric vehicles, particularly those containing next-generation power semiconductor devices such as silicon carbide and gallium nitride are operated at high temperatures exceeding 200 °C. Consequently, the reliability requirements for such modules have become highly stringent and new packaging materials and technologies are required to meet the demands of power electronic modules. Some good candidates for high temperature applications include high-temperature solders such as Au–20Sn, Ag or Cu sinter pastes, and transient liquid phase (TLP) bonding materials. In particular, the TLP bonding technology is suitable for use in high temperature environments owing to its low cost and simplicity of the bonding process. In this study, the feasibility of Cu–Sn and Ni–Sn TLP bonding technologies as die-attach methods for power electronics packaging applications is examined. The results of the study indicate that the Cu–Sn and Ni–Sn TLP bonding processes transform the joints fully into Cu6Sn5/Cu3Sn and Ni3Sn4 intermetallic compounds (IMCs), respectively. Further, the mechanical strength and reliability of the two TLP bonding joints are reduced owing to the formation of brittle IMCs.

Cu–Sn and Ni–Sn transient liquid phase bonding for die-attach technology applications in high-temperature power electronics packaging

Investigation of a rectangular heat pipe radiator with parallel heat flow structure for cooling high-power IGBT modules

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/Ni/Cu and Au-20Sn/Ni/Cu solder joints for power electronics applications

Reliability enhancement by integrated liquid cooling in power IGBT modules for hybrid and electric vehicles

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Reliability enhancement by integrated liquid cooling in power IGBT modules for hybrid and electric vehicles