A component capable of being exposed to a plasma in a process chamber has a structure having an electroplated coating comprising yttrium-containing species. The electroplated coating can include zirconium oxide, or can have an oxide layer thereon. In another embodiment the electroplated coating comprises a first species and is coated with a second electroplated coating comprising a second species that is different from the first species. The electroplated coating is resistant to corrosion in the plasma. In another embodiment, the electroplated coating has an interface having a thickness with a first concentration gradient of an yttrium-containing species and a second concentration gradient of a second species. An electroplated coating having a layer comprising first and second concentration gradients of first and second metals can be formed by varying the concentration of the first and second metal electrolyte species in the electroplating bath to electroplate the coating.

Process chamber component having electroplated yttrium containing coating

An electrostatic chuck includes a thermally conductive base having a plurality of heating elements disposed therein. A metal layer covers at least a portion of the thermally conductive base, wherein the metal layer shields the plurality of heating elements from radio frequency (RF) coupling and functions as an electrode for the electrostatic chuck. A plasma resistant dielectric layer covers the metal layer.

Single-body electrostatic chuck

An apparatus and method for abating toxic and/or hazardous gas species in a diluent gas stream line deriving from a by-pass line of a semiconductor process tool, comprising contacting the diluent gas stream with a dry resin sorbent material having an affinity for the toxic and/or hazardous gas species to effect the removal of at least a portion of the toxic and/or hazardous gas species by a chemisorbent or physisorbent reaction between the sorbent bed and the toxic gas component effectively reduces the concentration of the toxic gas component in the process diluent stream to below TLV.

Low pressure drop canister for fixed bed scrubber applications and method of using same

Embodiments of the present disclosure generally provide chamber components with enhanced thermal properties and methods of enhancing thermal properties of chamber components including bonding materials. One embodiment of the present disclosure provides a method for fabricating a composite structure. The method includes applying a bonding material to a first component, and converting the bonding material applied to the first component to an enhanced bonding layer by heating the bonding material to outgas volatile species from the bonding material. The outgassed volatile species accumulates to at least 0.05% in mass of the bonding material. The method further includes contacting a second component and the enhanced bonding layer to join the first and second components.

Electrostatic chuck and showerhead with enhanced thermal properties and methods of making thereof

The present invention discloses an electrostatic chuck for clamping work substrates, said chuck comprising three layers, where the dielectric constant of included non-conductive layers is selected to provide overall lower capacitance to the chuck. In the chuck assembly of the present invention, the top dielectric layer that is in contact with a substrate, such as, for example, a wafer, has a dielectric constant that is preferably greater than about 5, with a resistivity that is preferably greater than about 1E6 ohm.m, whereas the bottom dielectric layer has a dielectric constant that is preferably less than about 5 and a resistivity that is preferably greater than about 1E10 ohm.m. The intermediate layer preferably has a conductive layer where the resistivity is less than about 1 ohm.m. The electrostatic chuck may be bonded to heat sinks coated with anti-arc dielectrics. The heat sink can also be used as an RF electrode. The heat sink may have provisions for coolants and gas channels to feed a cooling gas to the backside of a wafer. The heat sink may have feed thrus to power the segmented electrodes in the electrostatic chuck. The passages for the feed thrus, gas feed holes and lift pins may be lined with ceramics or polymers to prevent any discharge to the heat sink. The electrostatic chuck is for clamping work substrates like Si, GaAs, SiO 2 , etc. used in semiconductor tools.

Polyceramic e-chuck

An electrostatic chuck has an electrode embedded in a dielectric which is mounted on a pedestal. The dielectric has a contact surface with an average surface roughness of less than about 0.5 μm, a surface peak waviness of less than about 0.12 μm, and a surface peak waviness material ratio of greater than about 20%. The surface texture can be formed by lapping the dielectric surface with a slurry of abrasive particles.

Electrostatic chuck having textured contact surface

In some aspects, a method is provided for abating perfluorocarbons (PFCs) in a gaseous waste abatement system having a pre-installed controlled decomposition oxidation (CDO) thermal reaction chamber. The method that includes (1) providing a catalyst bed within the CDO thermal reaction chamber; and (2) introducing a gaseous waste stream into the CDO thermal reaction chamber so as to expose the gaseous waste stream to the catalyst bed. Numerous other aspects are provided.

Methods and apparatus for pfc abatement using a cdo chamber

In one aspect of the invention, a method for the improved operation of an electronic device manufacturing system is provided. The method includes providing information to an interface coupled to an electronic device manufacturing system having parameters (405), processing the information to predict a first parameter (407), and providing an instruction related to at least a second parameter of the electronic device manufacturing system wherein the instruction is based on the predicted first parameter (409). Numerous other aspects are provided.

Methods and apparatus for improving operation of an electronic device manufacturing system

Apparatus for improved treatment of effluents are provided herein. In some embodiments, an abatement system may include an exhaust conduit to flow an effluent stream therethrough; a plurality of packed beds disposed in the exhaust conduit to remove non-exhaustible effluents from the effluent stream; one or more spray jets to provide an effluent treating agent between adjacent packed beds, the effluent treating agent to remove non-exhaustible effluents from the effluent stream; and a dripper disposed in the exhaust conduit above an uppermost packed bed to provide the effluent treating agent in large droplets to wet and rinse particulate from an upper surface of the uppermost packed bed substantially without forming fine droplets.

Abatement system having enhanced effluent scrub and moisture control

An abatement apparatus for introducing fuel into an electronic device manufacturing effluent abatement tool, including: a manifold; a fuel source adapted to supply fuel to the manifold through a fuel conduit; and a plurality of nozzles adapted to receive fuel from the manifold; wherein the manifold is adapted to supply fuel to the nozzles at a fuel velocity greater than a flame velocity.

Apparatus and methods for supplying fuel employed by abatement systems to effectively abate effluents

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