Antenna-in-package (AiP) technology, in which there is an antenna (or antennas) with a transceiver die (or dies) in a standard surface-mounted device, represents an important antenna and packaging technology achievement in recent years. AiP technology has been widely adopted by chipmakers for 60-GHz radios and gesture radars. It has also found applications in 77-GHz automotive radars, 94-GHz phased arrays, 122-GHz imaging sensors, and 300-GHz wireless links. It is believed that AiP technology will also provide elegant antenna and packaging solutions to the fifth generation and beyond operating in the lower millimeter-wave (mmWave) bands. Thus, one can conclude that AiP technology has emerged as the mainstream antenna and packaging technology for various mmWave applications. This article will provide an overview of the development of AiP technology. It will consider antennas, packages, and interconnects for AiP technology. It will show that the antenna choice is usually based on those popular antennas that can be easily designed for the application, that the package choice is governed for automatic assembly, and that the materials and processes choices involve tradeoffs among constraints, such as electrical performance, thermal–mechanical reliability, compactness, manufacturability, and cost. This article also shows a probe-based setup to measure mmWave AiP impedance and radiation characteristics. It goes on to give AiP examples implemented, respectively, in a low-temperature co-fired ceramic, an embedded wafer level ball grid array process, and a high-density interconnect processes. Finally, this article will summarize and present some recommendations on research topics to further the state of the art of AiP technology.

An Overview of the Development of Antenna-in-Package Technology for Highly Integrated Wireless Devices

This article presents the first 39-GHz phased-array transceiver (TRX) chipset for fifth-generation new radio (5G NR). The proposed transceiver chipset consists of 4 sub-array TRX elements with local-oscillator (LO) phase-shifting architecture and built-in calibration on phase and amplitude. The calibration scheme is proposed to alleviate phase and amplitude mismatch between each sub-array TRX element, especially for a large-array transceiver system in the base station (BS). Based on LO phase-shifting architecture, the transceiver has a 0.04-dB maximum gain variation over the 360° full tuning range, allowing constant-gain characteristic during phase calibration. A phase-to-digital converter (PDC) and a high-resolution phase-detection mechanism are proposed for highly accurate phase calibration. The built-in calibration has a measured accuracy of 0.08° rms phase error and 0.01-dB rms amplitude error. Moreover, a pseudo-single-balanced mixer is proposed for LO-feedthrough (LOFT) cancellation and sub-array TRX LO-to-LO isolation. The transceiver is fabricated in standard 65-nm CMOS technology with flip-chip packaging. The 8TX–8RX phased-array transceiver module 1-m OTA measurement supports 5G NR 400-MHz 256-QAM OFDMA modulation with −30.0-dB EVM. The 64-element transceiver has a EIRPMAX of 53 dBm. The four-element chip consumes a power of 1.5 W in the TX mode and 0.5 W in the RX mode.

/pdf/a-39-ghz-64-element-phased-array-transceiver-with-built-in-4dctytp6vh.pdf

A 39-GHz 64-Element Phased-Array Transceiver With Built-In Phase and Amplitude Calibrations for Large-Array 5G NR in 65-nm CMOS

This paper describes the design and implementation of a scalable $W$ -band phased-array system, with built-in self-alignment and self-test, based on an RFIC transceiver chipset manufactured in the TowerJazz 0.18- $\mu \text{m}$ SiGe BiCMOS technology with $f_{T}/f_{\text {MAX}}$ of 240/270 GHz. The RFIC integrates 24 phase-shifter elements (16TX/8RX or 8TX/16RX) as well as direct up- and down-converters, phase-locked loop with prime-ratio frequency multiplier, analog baseband, beam lookup memory, and diagnostic circuits for performance monitoring. Two organic printed circuit board (PCB) interposers with integrated antenna sub-arrays are designed and co-assembled with the RFIC chipsets to produce a scalable phased-array tile. Tiles are phase-aligned to one another through a daisy-chained local oscillator (LO) synchronization signal. Statistical analysis of the effects of LO misalignment between tiles on beam patterns is presented. Sixteen tiles are combined onto a carrier PCB to create a 384-element (256TX/128RX) phased-array system. A maximum saturated effective isotropic radiated power (EIRP) of 60 dBm (1 kW) is measured at boresight for the 256 transmit elements. Wireless links operating at 90.7 GHz using a 16-QAM constellation at a reduced EIRP of 52 dBm produced data rates beyond 10 Gb/s for an equivalent link distance in excess of 250 m.

A Fully Integrated 384-Element, 16-Tile, $W$ -Band Phased Array With Self-Alignment and Self-Test

A 144-element phased array transceiver is realized using a modular tiled approach that supports 802.11ad, MCS12 single carrier 16-quadratic-amplitude modulation (QAM) 4.6 Gbps, in the 60-GHz band. It consists of a system-on-a chip (SOC) (MAC/PHY/BB to IF) in 28-nm CMOS, and one IF-to-60-GHz transceiver master chip driving twelve 60-GHz phased array transceiver slave chips fabricated in a 40-nm CMOS. Using the master-slave configuration, the 60-GHz transceiver with 12 phase-controlled TX/RX slices is expanded to 144 phase-controlled slices. Each final TX/RX slice is then connected to two patch antennas on LTCC substrate. A tiled approach is used to create the 288 patch antenna array out of six identical tiles each with two slave 60-GHz transceivers connected to a 48-element antenna array. The single tile phased array with 48 antennas has a measured beam steering scan angle of 60° in azimuth and 10° in elevation. The full phased array transceiver with 288 antennas has a measured over the air (OTA) max effective isotropic radiated power (EIRP) of 51 dBm at saturated power (PSAT), and EIRP of 44.8 dBm with −22 dB EVM for MCS12 (16QAM-4.6 Gbps) at broadside. It has an OTA measured sensitivity of −87.3 and −80.4 dBm for MCS9 (QPSK-2.5 Gbps) and MCS12, respectively, at broadside. A packet error rate of 10−5 was measured for MCS9 and MCS12 with an OTA input power of −85 and −77.5 dBm, respectively, for the full phased array transceiver at broadside.

A 60-GHz 144-Element Phased-Array Transceiver for Backhaul Application

This article reviews current research and development as well as future opportunities for packaging and antenna integration technologies for silicon-based millimeter-wave phased arrays in emerging communication applications. Implementations of state-of-the-art silicon-based phased arrays below 100 GHz are discussed, with emphasis on array architectures for scaling, antenna integration options, substrate materials and process, antenna design, and IC-package codesign. Opportunities and challenges to support phased array applications beyond 100 GHz are then presented, including emerging packaging architectures, interconnect characterization requirements, thermal management approaches, heterogeneous integration of multifunction chiplets, and novel antenna technologies.

/pdf/packaging-and-antenna-integration-for-silicon-based-3hzn70kmtc.pdf

Packaging and Antenna Integration for Silicon-Based Millimeter-Wave Phased Arrays: 5G and Beyond

The 802.11ad standard (WiGig) provides throughput speeds of multi-Gb/s covering tens of meters and uses beamforming in the four 2GHz-wide channels in the 60gHz ISM band. Conventional backhaul solutions, on the other hand, are designed with high gain directional antennas with no electronic beam steering and have high cost for installation and alignment of antennas. This paper presents a full-featured 802.11ad chipset with 144-element phased array using a tiled approach and CMOS IPs developed for WiGig to address low-cost municipal WiFi, small-cell backhauling, and broadband to home covering the last mile. Designed with a link budget of 120dB+, the phased-array solution can be mounted on top of lamp posts and roof-top buildings covering a 200m LOS, and with tens of hops a range of 2km can be covered from a single point of fiber. Moreover, the steerable phased arrays enable dynamic routing optimization between hopping nodes in a mesh network.

A 60GHz 144-element phased-array transceiver with 51dBm maximum EIRP and ±60° beam steering for backhaul application

A communication device includes a donor receiver that receives a first beam of input radio frequency (RF) signals from a base station or a network node. The communication device further includes a service transmitter that transmits a second beam of RF signals in a first radiation pattern to a user equipment (UE). The communication device further includes control circuitry that detects an amount and a direction of echo signals at the donor receiver. The control circuitry applies polarization to the second beam of RF signals transmitted to the UE and calibrates the polarization to minimize the echo signals at the donor receiver. A second radiation pattern is generated for the second beam of RF signals and communicated to the UE based on the calibrated polarization. The communication of the second beam of RF signals in the generated second radiation pattern further reduces the echo signals at the donor receiver.

Communication device and method for echo signals management

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A 60-GHz 144-Element Phased-Array Transceiver for Backhaul Application

A 60GHz 144-element phased-array transceiver with 51dBm maximum EIRP and ±60° beam steering for backhaul application

Communication device and method for echo signals management