A. Ostmann
Fraunhofer Society
49 Papers
359 Citations
A. Ostmann is an academic researcher from Fraunhofer Society. The author has contributed to research in topics: Printed circuit board & Electronic component. The author has an hindex of 12, co-authored 49 publications.
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Papers
Highly integrated flexible electronic Circuits and Modules
Thomas Loher,Manuel Seckel,B. Pahl,L. Bottcher,A. Ostmann,Herbert Reichl +5 more
- 01 Oct 2008
TL;DR: In this paper, the authors investigated the frontiers of flexible circuit fabrication with respect to minimum feasible line width and pitch using different manufacturing methods, and two technologies for embedding of ultra thin components were developed.
43
Technical Understanding of Resin-Coated-Copper (RCC) Lamination Processes for Realization of Reliable Chip Embedding Technologies
Dionysios Manessis,Shiu-Fang Yen,A. Ostmann,Rolf Aschenbrenner,Herbert Reichl +4 more
- 25 Jun 2007
TL;DR: In this article, the authors focus on the lamination technology employed for the development of a production-capable technology for embedding active components and chips into printed circuit boards (PCBs).
40
Realization of a stackable package using chip in polymer technology
A. Ostmann,A. Neumann,S. Weser,Erik Jung,Lars Böttcher,Herbert Reichl +5 more
- 07 Aug 2002
TL;DR: A new approach will be described which allows both extreme dense 3-dimensional integration and very short interconnects between chips and passive components, and is based on the integration of thin components into build-up layers of printed circuit boards.
40
Stackable system-on-packages with integrated components
TL;DR: Two approaches for stacking SOPs were presented, the so-called chip-in-polymer (CIP) technology and duromer molded interconnect device (MID)/WLP technology.
35
Industrial and technical aspects of chip embedding technology
A. Ostmann,Dionysios Manessis,J. Stahr,M. Beesley,Maarten Cauwe,J. De Baets +5 more
- 21 Nov 2008
TL;DR: In this article, the authors discuss the technology and manufacturing challenges arising from the integration of embedding technologies to PCB manufacturing processes, and present a new testing methodologies and a new supply chain will be created due to incorporation of embeddings to PCB production, which will benefit the most from this combination without the difficulties of transport between different manufacturing plants.