The objective of this review is to study the interfacial intermatallic compounds (IMCs) between Sn–Ag–Cu based solders and common substrates, which play a crucial role in solder joints typically present in Pb-free electronics manufacturing. The microstructural evolution of IMCs at the solder/substrate interfaces is analyzed, while the models and theories describing the formation/growth mechanism of interfacial IMCs are also introduced. We focus on the influence of a variety of factors that have been reported recently, including substrates, minor alloying, mechanical stress, electromigration and thermomigration etc., as full understanding of the mechanisms that determine the formation and growth of interfacial IMCs is important to reach for developing high reliability solder joints. In the end of this review, the characteristics of the IMCs are compared and illustrated, which have marked effect on the mechanical properties and fracture behavior as well as reliability of solder joints.

A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates

Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate

/pdf/size-effect-model-on-kinetics-of-interfacial-reaction-cesqr2f4zw.pdf

Evolution of CuSn intermetallics between molten SnAgCu solder and Cu substrate

The effects of solder volume and Cu concentration on the consumption rate of Cu pad during reflow soldering

Kinetics of intermetallic compound layers and shear strength in Bi-bearing SnAgCu/Cu soldering couples

The focus of this study is on the role of Cu content in the dissolution kinetics of Cu in high-Sn solders during the solid/liquid reaction accompanied by interfacial intermetallic compound formation. Small additions of Cu (0.7%, 1.5%) in high-Sn solders dramatically decrease the dissolution rate of Cu at low temperatures. Sn-3.5Ag, as expected, has a dissolution rate similar to that of pure Sn. The difference in dissolution rate of Cu in various molten solders is explained in terms of the solubility limit of Cu in molten solders based on the Cu-Sn phase diagram. The correlation between the metallurgical aspects of interfacial η(Cu6Sn5) phase formation and dissolution kinetics of Cu in molten solders leads to an understanding of the mechanism that controls the dissolution rate of Cu in molten solders.

Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders

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Role of Cu in dissolution kinetics of Cu metallization in molten Sn-based solders