This Review provides a brief summary of the most recent research developments in the fabrication and application of one-dimensional ordered conducting polymers nanostructure (especially nanowire arrays) and their composites as electrodes for supercapacitors. By controlling the nucleation and growth process of polymerization, aligned conducting polymer nanowire arrays and their composites with nano-carbon materials can be prepared by employing in situ chemical polymerization or electrochemical polymerization without a template. This kind of nanostructure (such as polypyrrole and polyaniline nanowire arrays) possesses high capacitance, superior rate capability ascribed to large electrochemical surface, and an optimal ion diffusion path in the ordered nanowire structure, which is proved to be an ideal electrode material for high performance supercapacitors. Furthermore, flexible, micro-scale, threadlike, and multifunctional supercapacitors are introduced based on conducting polyaniline nanowire arrays and their composites. These prototypes of supercapacitors utilize the high flexibility, good processability, and large capacitance of conducting polymers, which efficiently extend the usage of supercapacitors in various situations, and even for a complicated integration system of different electronic devices.

Conducting Polymer Nanowire Arrays for High Performance Supercapacitors

This article focuses on the fabrication and characterization of stretchable interconnects for wearable electronics applications. Interconnects were screen-printed with a stretchable silver-polymer composite ink on 50-μm thick thermoplastic polyurethane. The initial sheet resistances of the manufactured interconnects were an average of 36.2 mΩ/◽, and half the manufactured samples withstood single strains of up to 74%. The strain proportionality of resistance is discussed, and a regression model is introduced. Cycling strain increased resistance. However, the resistances here were almost fully reversible, and this recovery was time-dependent. Normalized resistances to 10%, 15%, and 20% cyclic strains stabilized at 1.3, 1.4, and 1.7. We also tested the validity of our model for radio-frequency applications through characterization of a stretchable radio-frequency identification tag.

/pdf/screen-printing-fabrication-and-characterization-of-3o3pwiwat0.pdf

Screen-Printing Fabrication and Characterization of Stretchable Electronics

Ubiquitous computing is about to become part of our everyday lives by integrating hundreds of “invisible” to us computing devices in our environment, so that they can unobtrusively and constantly assist us. This will imply more and smaller “invisible” sensors, homogeneously distributed and at the same time densely packed in host materials, responding to various stimuli and immediately delivering information. In order to reach this aim, the embedded sensors should be integrated within the host material, heading towards sensorial materials. The first step is to omit all parts that are not needed for the sensorial task and to find new solutions for a gentle integration. This is what we call function scale integration. The paper discusses sensor embedding in the human hand as an example of integration in nature, new technological applications and main challenges associated with this approach.

From embedded sensors to sensorial materials—The road to function scale integration

An innovative technology for the mass production ofstretchable printed circuit boards (SCBs) will bepresented in this paper. This technology makes itpossible for the first time to really integrate fine pitch,high performance electronic circuits easily into textilesand so may be the building block for a totally newgeneration of wearable electronic systems. Anoverview of the technology will be given andsubsequently a real system using SCB technology ispresented.

Stretchable Circuit Board Technology and Application

In recent years, the integration of electronics in technical textiles has gained increasing attention especially in Europe. Many industry driven projects have already been started in this area on national as well as on European level. An example is the European project PASTA. In order to make the step towards industrial manufacturing of wearable electronics as well as smart large area technical textiles it is necessary to develop modular concepts as well as integration processes suitable for high volume production. Within PASTA new electronic packaging technologies and the development of new textile structures are investigated. By introducing new concepts for electronic packaging and module interconnects, a seamless, more comfortable and more robust integration of electronics in textiles will be possible. The main technological developments concentrate on different levels of integration: a new concept for bare die integration into a yarn, a new interconnect technology based on mechanical crimping, and the development of a stretchable interposer serving as a stress relief interface between the rigid component and the elastic fabric. The technologies will also be analyzed and evaluated regarding functionality and reliability. The proposed solutions for integration of electronics in textiles will cover a whole range of components, from ultra-small LEDs to complex multichip modules for sensor data processing. Moreover, a system design task will address the power distribution and system partitioning aspects to provide a complete solution for integration of a distributed sensor/actuator system in fabric. Different approaches are possible for large area sensors in textiles. The scope of this paper is to show which technologies enable the use of conductive yarns in a fabric for pressure and damage detection and in-situ monitoring of accumulated stress in composites to predict the residual lifetime and to indicate damage of industrial components.

Large area sensor integration in textiles

Assembly of electronic components on rigid and/or flexible printed circuit boards is today the customary way to fabricate electronic systems in stationary, mobile and automotive applications On the other hand, many of the demands from emerging application fields like wearable and textile electronics cannot be met if with standard technologies These fields have therefore become mayor drivers for the development of novel technologies Among these dasiastretchable electronicspsila have attracted much attention recently Especially for textile applications the potential of the electronic system to comply with the body shape and movement will considerably improve the user comfort In this paper we will present a cost effective technology for the realization of stretchable systems by common printed circuit board techniques like lamination, lithography, etching and micro via technology with polyurethane as a stretchable matrix/substrate material Mastering of the adhesion between materials and the transitions region from stretchable to non-stretchable parts of the system are crucial for the mechanical performance and robustness Technical approaches and the obtained results to tackle these issues will be presented After a complete embedding of the components/interconnections the systems can be firmly attached to textile or non-woven cloth, which can be subsequently integrated into garments The described process technology bears the potential for large scale roll to roll processing Reliability aspects for stretchable electronic systems are so far not standardized and will be discussed briefly Electrical and mechanical functionality of test vehicles subjected to multiple stretch and mild washing cycles will be presented A functional electronic demonstrator with embedded passives, a micro controller, and LEDs which was realized with this technology will be shown

Stretchable electronic systems for wearable and textile applications

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Stretchable electronic systems for wearable and textile applications