Many materials systems are currently under consideration as potential replacements for SiO2 as the gate dielectric material for sub-0.1 μm complementary metal–oxide–semiconductor (CMOS) technology. A systematic consideration of the required properties of gate dielectrics indicates that the key guidelines for selecting an alternative gate dielectric are (a) permittivity, band gap, and band alignment to silicon, (b) thermodynamic stability, (c) film morphology, (d) interface quality, (e) compatibility with the current or expected materials to be used in processing for CMOS devices, (f) process compatibility, and (g) reliability. Many dielectrics appear favorable in some of these areas, but very few materials are promising with respect to all of these guidelines. A review of current work and literature in the area of alternate gate dielectrics is given. Based on reported results and fundamental considerations, the pseudobinary materials systems offer large flexibility and show the most promise toward success...

/pdf/high-k-gate-dielectrics-current-status-and-materials-zjvba0c4u8.pdf

High-κ gate dielectrics: Current status and materials properties considerations

The outstanding properties of SiO2, which include high resistivity, excellent dielectric strength, a large band gap, a high melting point, and a native, low defect density interface with Si, are in large part responsible for enabling the microelectronics revolution. The Si/SiO2 interface, which forms the heart of the modern metal–oxide–semiconductor field effect transistor, the building block of the integrated circuit, is arguably the worlds most economically and technologically important materials interface. This article summarizes recent progress and current scientific understanding of ultrathin (<4 nm) SiO2 and Si–O–N (silicon oxynitride) gate dielectrics on Si based devices. We will emphasize an understanding of the limits of these gate dielectrics, i.e., how their continuously shrinking thickness, dictated by integrated circuit device scaling, results in physical and electrical property changes that impose limits on their usefulness. We observe, in conclusion, that although Si microelectronic devices...

Ultrathin (<4 nm) SiO2 and Si-O-N gate dielectric layers for silicon microelectronics: Understanding the processing, structure, and physical and electrical limits

Recent advances in experimental techniques (on-the- fly and ultrafast techniques) allow measurement of threshold voltage degradation due to negative-bias temperature instability (NBTI) over many decades in timescale Such measurements over wider temperature range (-25degC to 145degC), film thicknesses (12-22 nm of effective oxide thickness), and processing conditions (variation of nitrogen within gate dielectric) provide an excellent framework for a theoretical analysis of NBTI degradation In this paper, we analyze these experiments to refine the existing theory of NBTI to 1) explore the mechanics of time transients of NBTI over many orders of magnitude in time; 2) establish field dependence of interface trap generation to resolve questions regarding the appropriateness of power law versus exponential projection of lifetimes; 3) ascertain the relative contributions to NBTI from interface traps versus hole trapping as a function of processing conditions; and 4) briefly discuss relaxation dynamics for fast-transient NBTI recovery that involves interface traps and trapped holes

/pdf/recent-issues-in-negative-bias-temperature-instability-516v1ys8p8.pdf

Recent Issues in Negative-Bias Temperature Instability: Initial Degradation, Field Dependence of Interface Trap Generation, Hole Trapping Effects, and Relaxation

The microelectronics industry owes its considerable success largely to the existence of the thermal oxide of silicon. However, recently there is concern that the reliability of ultra-thin dielectrics will limit further scaling to slightly thinner than 2 mm. This paper will review the physics and statistics of dielectric wearout and breakdown in ultrathin SiO/sub 2/-based gate dielectrics. Electrons or holes tunneling through the gate oxide generate defects until a critical density is reached and the oxide breaks down. The critical defect density is explained by the formation of a percolation path of defects across the oxide. Only 1 year) stress experiments are now being used to measure the wearout and breakdown of ultrathin (<2 nm) dielectric films as close as possible to operating conditions. These measurements have revealed the details of the voltage dependence of the defect generation rate and critical defect density, allowing better modeling of the voltage dependence of the time-to-breakdown, Such measurements are used to guide the technology development prior to the manufacturing stage. We then discuss the nature of the electrical conduction through a breakdown spot and the effect of the oxide breakdown on device and circuit performance. In some cases, an oxide breakdown does not lead to immediate circuit failure, so more research is needed in order to develop a quantitative methodology for predicting the reliability of circuits.

/pdf/physical-and-predictive-models-of-ultrathin-oxide-44bw6q1dcp.pdf

Physical and predictive models of ultrathin oxide reliability in CMOS devices and circuits

The present understanding of wear-out and breakdown in ultrathin (t/sub ox/ < 5.0 nm) SiO/sub 2/ gate dielectric films and issues relating to reliability projection are reviewed in this article. Recent evidence supporting a voltage-driven model for defect generation and breakdown, where energetic tunneling electrons induce defect generation and breakdown will be discussed. The concept of a critical number of defects required to cause breakdown and percolation theory will be used to describe the observed statistical failure distributions for ultrathin gate dielectric breakdown. Recent observations of a voltage dependent voltage acceleration parameter and non-Arrhenius temperature dependence will be presented. The current understanding of soft breakdown will be discussed and proposed techniques for detecting breakdown presented. Finally, the implications of soft breakdown on circuit functionality and the applicability of applying current reliability characterization and analysis techniques to project the reliability of future alternative gate dielectrics will be discussed.

Ultrathin gate oxide reliability: physical models, statistics, and characterization

The important components of reliability projection are investigated. Acceleration parameters are obtained for a 1.6 nm oxide with a soft breakdown criterion. Based on the physical percolation model, the voltage scaling factor for time to breakdown is found to increase with lower voltage, explaining the experimental observation of 6.7 ± 0.4 dec V-1 for the 1.6 nm oxide. The distribution of breakdown times is shown to be sensitive to thickness variation across the test wafer, and a Weibull slope of 1.38 ± 0.1 was obtained. The temperature dependence of the time to breakdown was found to be non-Arrhenius and to have a slope of 0.02 dec °C-1. Using these parameters, the 1.6 nm oxide was found to have a 10 year lifetime with a 100 ppm failure rate for 1.3 V operation at 100 °C. Our understanding of soft breakdown is described as well as an investigation of device operation after soft breakdown, which may further improve the reliability projection.

http://iopscience.iop.org/article/10.1088/0268-1242/15/5/304/pdf

Gate oxide reliability projection to the sub-2 nm regime

In this paper we report on the self-consistent modeling and simulation of quantization effects and tunneling current in MOS devices. The simulation model features an original scheme for the self-consistent solution of Poisson and Schrodinger equations and it is used for the extraction of the oxide thickness, by fitting CV curves, and the calculation of the tunneling current. Simulations and experiments are compared for different device types and oxide thicknesses (1.5-6.5 nm) showing good agreement and pointing out the importance of quantum mechanical modeling and the presence of many tunneling mechanisms in ultra-thin oxide MOS devices.

http://ieeexplore.ieee.org/iel5/6469/17293/00799305.pdf

Self-consistent simulation of quantization effects and tunneling current in ultra-thin gate oxide MOS devices

We describe the reliability projection methods currently used and show that 1.6 nm oxides are sufficiently reliable even if soft breakdown is considered the point of failure. We also explore the possibility of using oxides after soft breakdown.

Ultra-thin gate oxide reliability projections

We demonstrate that reliability projections can be improved significantly if oxide thickness uniformity is improved Our results include a Weibull slope of 138 for an extremely uniform 16 nm oxide, and also a steeper voltage scaling factor than has been used in the past Transistors with 50 nm gate-length and /spl sim/15 nm oxides exhibit soft breakdown, suggesting that it may be possible to relax current reliability specifications

Gate oxides in 50 nm devices: thickness uniformity improves projected reliability

Handle everyday research tasks with reliable, citation-backed results

Your personal Research Agent to handle research tasks with citation-backed results

Popular Tasks used by Researchers

How can I help with your research?

Meet SciSpace

Get more enhanced response by uploading the PDFs you want me to reference.

No relevant PDFs in your library

SciSpace is the AI research assistant for academics. Run systematic literature reviews on 280M+ papers, and write papers with cited sources. Trusted by 1M+ students, PhDs & researchers.

SciSpace | AI for Research

Analyze PDFs

Code & Manuscripts

Funding & Grants

Literature & Patents

Medical & Clinical Data

Systematic Review

Visualize & Present

Web & Data

Build a Google Scholar-like website for your research.

Build a website

Create charts and images for your research

Create a Chart

Write a paper for submission to a journal

Draft a manuscript

Patent Search

Design eye-catching scientific posters in minutes.

Scientific Poster Generation

Systematic Literature Review

One task is running at the moment. Your messages will be shown right after.

Drag and drop or click here to browse

Loved by <highlight>1 million+</highlight> researchers

Extract a list of specific topics and their sources from unstructured text

Topics

Compare and analyze relevant papers that matches with your search

Papers

Get insights from PDFs and bookmarked papers from your library

My library

Recent searches

Try searching for:

Catch AI-generated content in scholarly and non-scholarly content

{ai} Detector

Ai Writer

Get PDF Summaries, highlighted text explanations 

Chat with PDF

Effortlessly create in-text citations and bibliographies in APA and 2,500 other formats

Citation generator

Get explanations, summaries, and answers on academic papers

Ease up your research workflow with {scispace}'s cohort of exciting AI tools

Elevate your academic writing skills and convey your ideas the way you want

Paraphraser

Explore our range of reading and writing tools

Your file is being prepared and should be ready in a few minutes. If it's a large file, it might take a bit longer. You can close this window, and we'll email you the file when it's done.

You have reached a maximum limit of <strong>{limit}</strong> columns in the table. Remove at least <strong>1</strong> column to add or create another one.

A. Hamad

Author Tools

Chat about Author

Papers

Gate oxide reliability projection to the sub-2 nm regime

Self-consistent simulation of quantization effects and tunneling current in ultra-thin gate oxide MOS devices

Ultra-thin gate oxide reliability projections

Gate oxides in 50 nm devices: thickness uniformity improves projected reliability