A review of heat transfer and pressure drop characteristics of single and two-phase microchannels

Power dissipation in microprocessors will reach a level that necessitates chip-level liquid cooling in the near future. An on-chip microfluidic heat sink can reduce the thermal interfaces between an IC chip and the convective cooling medium. Through wafer-level processing, integrated thermal-fluidic I/O interconnects enable on-chip microfluidic heat sinks with ultrasmall form factor at low-cost. This letter describes wafer-level integration of microchannels at the wafer back-side with through-wafer fluidic paths and thermal-fluidic input/output interconnection for future generation gigascale integrated chips.

Integrated thermal-fluidic I/O interconnects for an on-chip microchannel heat sink

At present, miniaturization of the devices in order to make them for effective performance, reliability and ease at cost is the primary need of any nation. In this direction, the role of microchannels can play an important role in the further development of industrial growth. The increased demand of the microchips in the industrial areas has increased the number of transistors for the improved functionality which leads to the emission of the higher heat flux, which is already a big challenge in the electronic sector. In the present paper, a comprehensive review on microchannels has been done regarding single-phase and multi-phase studies. In the present paper, an intensive review of the thermal and hydraulic characteristics of fluid flow in microchannels at different hydraulic diameters and their effects on performance has been done. The effects of the various parameters such as the Reynolds number (Re), Nusselt number (Nu), friction factor (f), pressure drop (P), working fluid and cross-sectional geometry of duct, as well as the hydrodynamic and thermal aspects, has been also studied. It was concluded through the literature study that transition from laminar to turbulent is very much affected by channel cross-sectional geometry, aspect ratio, channel wall roughness and compressibility effects. Also, researchers only explored the laminar region for its pressure drop and heat transfer characteristics, while the turbulent flow regime is yet to be explored. It was observed that most of the correlation over-estimated the value of pressure drop in multi-phase flow.

A study on thermohydraulic characteristics of fluid flow through microchannels

The present invention is disclosed a microchannel array structure embedded in a silicon substrate and a fabrication method thereof. The microchannel array structure of the present invention is formed deep inside the substrate and has high-density microscopic micro-channels. Besides, going through surface micromachining, physical and chemical properties of the silicon substrate are hardly influenced by the fabrication procedures. With microchannels buried in the substrate, the top of a microchannel array structure becomes flat, minimizing the effect of step height. That way, additional devices such as passive components, micro sensors, micro actuators and electronic devices can be easily integrated onto the microchannel array structure. The microchannel array structure of the present invention can be employed as a basic fluidic platform for miniaturizing and improving perfomances of electronic device coolers as well as such fluidic micro-electro-mechanical system (MEMS) devices as biochips, microfluidic components and chemical analyzers, lab-on-a-chips, polymerase chain reaction (PCR) amplifiers, micro reactors and drug delivery systems.

Method of fabricating microchannel array structure embedded in silicon substrate

A laser device includes a laser rod; a radial array of diode laser pumping devices, wherein each diode laser has a solid connection to the laser rod to maximize laser energy transfer. The diode laser radial array is serially connected via coatings and/or fingers and/or spheres. Cooling of the laser rod and the diode laser radial array is accomplished via a common fluid channel outside the laser rod, wherein a cooling fluid flows past the laser rod and the diode laser radial array. Innovative methods for creating the coating embodiments are disclosed. Various flat diode laser embodiment are also disclosed.

Monolithic radial diode-pumped laser with integral micro channel cooling

This paper describes a novel packaging technology for high power multi chip modules (MCMs). The work covers three areas: The fabrication of a multichip module which provides access to the die backside for heat removal, the development of high performance microchannel heat sinks with a CTE matched to the MCM-substrate as well as a low thermal resistivity assembling technology of the two components. The MCM is fabricated by means of the planar embedding technology. By planarizing the module backside a low thermal resistance between heat sink and dice can be accomplished simultaneously for all embedded components. While offering the same high interconnection density and the high speed performance benefit of flip chip and providing high reliability and very small size of the overall package, this alternative technology promises to eliminate crucial problems associated with backside cooling of flip chip devices.

High power multichip modules employing the planar embedding technique and microchannel water heat sinks

High performance aluminium nitride water cooled heat sinks were fabricated and characterized. A variety of fabrication processes were employed to meet different cooling requirements. They include laser cut microchannel coolers for chip and multichip heat sinks as well as dry pressed pin fin heat sinks for power electronics. Thermal simulation was used to optimize the heat sink design.

High performance liquid cooled aluminium nitride heat sinks

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High power multichip modules employing the planar embedding technique and microchannel water heat sinks

High performance liquid cooled aluminium nitride heat sinks