6 Papers
74 Citations
A. Das is an academic researcher from Katholieke Universiteit Leuven. The author has contributed to research in topics: Dielectric & Porosity. The author has an hindex of 4, co-authored 6 publications.
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Papers
Post patterning meso porosity creation: a potential solution for pore sealing
Rudy Caluwaerts,M. Van Hove,Gerald Beyer,Romano Hoofman,Herbert Struyf,G.J.A.M. Verheyden,Joost Waeterloos,Zsolt Tokei,Francesca Iacopi,L. Carbonell,Quoc Toan Le,A. Das,I. Vos,Steven Demuynck,Karen Maex +14 more
- 02 Jun 2003
TL;DR: In this paper, the creation of meso porosity in single damascene structures after patterning has been investigated to facilitate the sealing of the sidewalls by iPVD barriers.
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Characterisation and integration feasibility of JSR's low-k dielectric LKD-5109
A. Das,T. Kokubo,Y. Furukawa,Herbert Struyf,I. Vos,B. Sijmus,Francesca Iacopi,J. Van Aelst,Quoc Toan Le,L. Carbonell,Sywert Brongersma,M. Maenhoudt,Zsolt Tokei,Iwan Vervoort,Erik Sleeckx +14 more
TL;DR: In this article, the feasibility of integrating LKD-5109 in a single inlaid structure has been investigated Thermal stability, chemical compatibility to stripping agents and CMP slurries are verified.
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Dependence of the minimal PVD TA(N) sealing thickness on the porosity of Zirkon TM LK Dielectric films
Francesca Iacopi,C. Zistl,C. Jehoul,Zs. Tokei,Quoc Toan Le,A. Das,C. Sullivan,Greg Prokopowicz,D. Gronbeck,Mike Gallagher,Jeff Calvert,Karen Maex +11 more
TL;DR: In this paper, the porosity of Zirkon™ low-k dielectric films and the physical vapom deposition (PVD) Ta(N) thickness needed to achieve an efficient sealing of the dielectrics surface were investigated.
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Impact of LKD5109 TM low- k to cap/liner interfaces in single damascene process and performance
Francesca Iacopi,M. Patz,I. Vos,Zs. Tokei,B. Sijmus,Quoc Toan Le,Erik Sleeckx,B. Eyckens,Herbert Struyf,A. Das,Karen Maex +10 more
TL;DR: In this paper, the importance of interface quality in the single damascene integration process of LKD5109TM porous low-k films is investigated, and a strong correlation is observed between chemical mechanical planarization (CMP) performance and interfacial fracture energies.
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Cu/LKD-5109 damascene integration demonstration using FF-02 low-k spin-on hard-mask and embedded etch-stop
T. Kokubo,A. Das,Yukiko Furukawa,I. Vos,Francesca Iacopi,Herbert Struyf,Joke Van Aelst,M. Maenhoudt,Zsolt Tokei,Iwan Vervoort,Hugo Bender,Michele Stucchi,Marc Schaekers,Werner Boullart,M. Van Hove,S. Vanhaelemeersch,W. Peterson,A. Shiota,Karen Maex +18 more
- 07 Aug 2002
TL;DR: In this paper, the feasibility of integrating low-k spin-on dielectrics into a Cu damascene structure using JSR's LKD-5109 (k = 2.2) has been investigated.
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